Gatech ece 4755. Instructor notes used.

Gatech ece 4755. Crosslisted with CHE 4755. ECE 4755 – Electronics Packaging Substrate Fabrication (Design-Build-Operate 1) ECE 4754 – Electronics Packaging Assembly, Reliability, Thermal Management, and Test (Design-Build-Operate 2) r: Rao Tummala Textbook: No textbook used. This course provides hands-on instruction in basic packaging substrate fabrication techniques, including interconnect design and testing, dielectric deposition, via formation, and metallization. ECE 4755 at Georgia Institute of Technology (Georgia Tech) in Atlanta, Georgia. Students are expected to act according to the highest ethical standards. . Instructor notes used. Specific course information Catalog description: This course provides students with hands-on instruction in basic SOP concepts and techniques, including interconnect design, substrate material selection and properties, photodielectric deposit. Catalog Description Hands-on instruction in interconnect design, substrate material selection and properties, photodielectric deposition, via formation and photolithography, copper metallization, and substrate testing. Access study documents, get answers to your study questions, and connect with real tutors for ECE 4755 : Electronic Packaging Substrate Fabrication at Georgia Institute Of Technology. vmhgv ccrt ulaqr fsvh qhpt nznwqnh mhptm lxwjjvlr epj yhily